Brian Krzanich says the company will do things it's never done before -- like getting chips from outside the company and putting more emphasis on 3G and LTE processors. November 21, 2013 1:21 PM PST Intel CEO Brian Krzanich is serious about shaking things up. Intel's CEO is putting the world's largest chipmaker on a fast track to change. That become clear Thursday at the company's investor meeting. Intel will open its factories to "any company" that wants to tap its leading-edge manufacturing capabilities, CEO Brian Krzanich said today. To date, Intel has taken a very cautious, small-scale approach to making chips on a contract-manufacturing basis. Related stories Intel to open first retail stores in time for the holidays Separately, in one of the biggest revelations, Intel will develop a phone chip called "SoFIA" that will be built at a factory outside the company for 2014. If investors are looking for a sign of changes at Intel, this is probably the biggest. That chip will have integrated global 3G and HSPA+. And Intel is pursuing the tablet market with a vengeance. The company is aiming to quadruple tablets shipped with its chips to 40 million tablets in 2014. Another sign is Intel's newfound focus on modem chips. For example, a future multimode modem will integrate the latest broadband tech, including TD-LTE and TD-SCDMA.
Brian Krzanich says the company will do things it's never done before -- like getting chips from outside the company and putting more emphasis on 3G and LTE processors.
Intel CEO Brian Krzanich is serious about shaking things up.
Intel's CEO is putting the world's largest chipmaker on a fast track to change. That become clear Thursday at the company's investor meeting.
Intel will open its factories to "any company" that wants to tap its leading-edge manufacturing capabilities, CEO Brian Krzanich said today.
To date, Intel has taken a very cautious, small-scale approach to making chips on a contract-manufacturing basis.
Separately, in one of the biggest revelations, Intel will develop a phone chip called "SoFIA" that will be built at a factory outside the company for 2014. If investors are looking for a sign of changes at Intel, this is probably the biggest.
That chip will have integrated global 3G and HSPA+.
And Intel is pursuing the tablet market with a vengeance. The company is aiming to quadruple tablets shipped with its chips to 40 million tablets in 2014.
Another sign is Intel's newfound focus on modem chips. For example, a future multimode modem will integrate the latest broadband tech, including TD-LTE and TD-SCDMA.
